What are blind and buried vias in PCB?

Blind and buried vias are only available on boards with four layers in SMT production. Unlike conventional through holes on two-layer boards that connect two surface layers in SMT processing, buried and blind vias connect inner layers with other adjacent inner layers or adjacent surface layers. Blind vias: connect the inner layer with the adjacent surface layer, they are only visible on one side of the board, hence the name " blind vias". Blind Via: Connects two adjacent inner copper layers. They are not visible from the surface and are thus " buried".

Using blind and buried vias in pcb design has its advantages and disadvantages. The advantage, of course, is that the technology provides a viable design technique that helps meet the density constraints of lines and pads in typical designs without increasing layer count or board size. The downside of this technique is that boards using blind and/or buried vias cost significantly more than typical multilayer boards with the same number of layers due to the extra operations involved in manufacturing the board.

Peck Drilling Blind Holes

Drilling depth is very important in through holes, because too shallow or too deep can have a dangerous effect on the board. You can also create spurs and rough edges that can cause problems if you' re not careful. That is, companies can reduce costs through blind holes if they are made by peck drilling. Peck drilling involves inserting a drill bit into the board multiple times to remove material buildup and prevent rough spots.